Vapor Phase Reflow Soldering Machine for Hobby and Laboratory single pieces up to small quantities

MINI CONDENS-IT PROFILER

The IMDES MINI CONDENS-IT PROFILER is designed for reflow soldering laboratory and prototype, single pieces and small quantities PCB’ S. Components such as QFPs, BGAs, Flip-Chips as well as hybrids are processed defect free with highest quality results. Due the small footprint of the MINI CONDENS-IT PROFILER it may be used at any place.

 

Features

  • Table model Top loader
  • Adjustable temperature profiles in the pre-heating zone (CVPRS*)
  • Adjustable TAL Time Above Liquid
  • ATS Anti Tomb Stone modus
  • Micro USB for the transfer of solder profile data to PC
  • Window to observe the soldering process
  • Suitable for BGA’s, Stacked Packages
  • Oxygen Free Soldering
  • Homogeneous temperature transmission on the complete Assembly
  • No over heating of components

*Creative Vapor Phase Reflow Software

 

MINI CONDENS IT PROFILER

Order No

Price

IMDES Vapor Phase soldering machine MINI CONDENS IT PROFILER , excluding transfer medium

IMD-MNI-PROF1

Medium basic filling Galden LS230 Reflow Fluid for lead free applications

Quantity 0,5 Liter = 910 Gram

IMD-GL 230-0.5

Energy supply (Single Phase + ground)

220-240 Volt / 50-60 Hz

Power drawn

1.000 Watt (ca. 5 A)

System dimensions

400 x 315x 305 mm (L x B x H)

max. solder product format

240 x 170 x 20 mm (L x B x H)
PCB‘s up to double Euro card format

Standard cycle time

10 Min

Soldering time

 

ca. 60 – 90 Seconds

Process temperature (depends on medium type)

150 bis 240 °C

Weight

ca. 6 kg

Cooling

Forced air cooling

Heat transfer medium

GALDEN with the correct boiling temperature (max. 240 °C) higher Temperature is not possible

Medium basic filling quantity

ca. 450– 500 ml GALDEN

Alle Informationen zum Herunterladen finden Sie in diesem PDF

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