Vapor Phase Reflow Soldering Machine for Hobby and Laboratory single pieces up to small quantities

MINI CONDENS-IT PROFILER

The IMDES MINI CONDENS-IT PROFILER is designed for reflow soldering laboratory and prototype, single pieces and small quantities PCB’ S. Components such as QFPs, BGAs, Flip-Chips as well as hybrids are processed defect free with highest quality results. Due the small footprint of the MINI CONDENS-IT PROFILER it may be used at any place.

Features

Table model Top loader
Adjustable temperature profiles in the pre-heating zone (CVPRS*)
Adjustable TAL Time Above Liquid
ATS Anti Tomb Stone modus
Micro USB for the transfer of solder profile data to PC
Window to observe the soldering process
Suitable for BGA’s, Stacked Packages
Oxygen Free Soldering
Homogeneous temperature transmission on the complete Assembly
No over heating of components

*Creative Vapor Phase Reflow Software

MINI CONDENS IT PROFILER		Order No	Price
IMDES Vapor Phase soldering machine MINI CONDENS IT PROFILER , excluding transfer medium		IMD-MNI-PROF1
Medium basic filling Galden LS230 Reflow Fluid for lead free applications Quantity 0,5 Liter = 910 Gram		IMD-GL 230-0.5
Energy supply (Single Phase + ground)	220-240 Volt / 50-60 Hz
Power drawn	1.000 Watt (ca. 5 A)
System dimensions	400 x 315x 305 mm (L x B x H)
max. solder product format	240 x 170 x 20 mm (L x B x H) PCB‘s up to double Euro card format
Standard cycle time	10 Min
Soldering time	ca. 60 – 90 Seconds
Process temperature (depends on medium type)	150 bis 240 °C
Weight	ca. 6 kg
Cooling	Forced air cooling
Heat transfer medium	GALDEN with the correct boiling temperature (max. 240 °C) higher Temperature is not possible
Medium basic filling quantity	ca. 450– 500 ml GALDEN