FAQ

What is vapor phase soldering?
Why Condensation Soldering Vapor Phase
How do costs compare with convection soldering?
Is Galden dangerous for the environment and humans?
More Information regarding Galden
Condensation soldering of double-sided SMD boards is this possible?
The tombstone effect and how to avoid it?
Is it possible to desolder remove complex devices using the vapor phase process
Can it be avoided that during the reflow process drops of Galden form on the process window and can then fall on the PCBA?
Which kind of Galdens are available and for which temperatures ?
What is vapor phase soldering?

Vapor phase soldering, also known as condensation soldering, achieves a very gentle and repeatable heating process. The temperature is limited to the boiling point of the liquid. The maximum solder temperature is much lower than any other reflow solder method. This is beneficial for all components and PCBs.

Why Condensation Soldering Vapor Phase

Vapor phase soldering provides greater process accuracy, higher quality solder joints, more gentle and consistently repeatable heating, lower reflow costs, environmentally friendly,… .

How do costs compare with convection soldering?

The costs of operation are lower than for convection soldering.

Is Galden dangerous for the environment and humans?

Information on the environment and humans can be found in this  doument 

Condensation soldering of double-sided SMD boards is this possible?

All information on double-sided condensation soldering can be found in this PDF

The tombstone effect and how to avoid it?

All information on the tombstone effect can be found in this PDF

Is it possible to desolder remove complex devices using the vapor phase process

Yes, you can safe and easy desoldering complex devices  with the vapor phase process if you are using IMDES DEsoldering system IMD-DSS-1!

Multi-poleSMD components

BGA’s

Connectors

mechanical elements

The IMDES soldering system IMD-DSS-1 is a fast and cost-effective aid for the rework of components (such as BGA’s and QFB’s).

Individual components can be easily and gently removed from an assembly.

For this purpose, the repair system is connected to the component, which is to be desoldered (removed) and driven together with the assembly through the vapor phase machine soldering system.

 

Can it be avoided that during the reflow process drops of Galden form on the process window and can then fall on the PCBA?

Yes, you can avoid this by

Yes, we have a solution!

At the bottom side of the lid under neath the glass window of, a  shaped thin stainless plate  (like roof of a house) will be mounted

Or a simple thin shaped  thin stainless steel  plate will be mounted  underneath the lid

You can do that yourself or we can supply you with the parts or a complete new lid.

See the attached pdf documents below

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Which kind of Galdens are available and for which temperatures ?

In the attached PDF document you will find an overviwe of the different types of Galden and it´s tempature ranges

Any other questions?
Contact us and we will be happy to help you

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