DINO CONDENS-IT

Kategorie: Condensation reflow soldering machines

4.700,00 €

Zzgl. USt. und Versand

Weight: 25 kg

HS Code: 85151990 HTS Code: 85151990 Country of origin Germany

Description

The DINO CONDENS-IT PROFILER is designed for reflow soldering laboratory and prototype, single pieces and small quantities PCB’ S. Components such as QFPs, BGAs, Flip-Chips as well as hybrids are processed defect free with highest quality results. Due the small footprint of the DINO CONDENS-IT PROFILER it may be used at any place.

Its simple fast set up ensures a rapid ready for use providing the ability to solder high quality assemblies defect free.

Features

Table model Top loader
Adjustable temperature profiles in the pre-heating zone (CVPRS*)
Adjustable TAL Time Above Liquid
ATS Anti Tomb Stone modus
Micro USB for the transfer of solderprofile data to PC
Window to observe the soldering process
Suitable for BGA’s, Stacked Packages
Oxygen Free Soldering
Homogeneous temperature transmission on the complete Assembly
No over heating of components

*Creative Vapor Phase Reflow Software

DINO CONDENS IT PROFILER		Order. No.
DINO CONDENS IT PROFILER, excluding heat transfer medium		IMD-DINO-1 Prof
Heat Transfer Medium base filling Galden LS230 Reflow Medium for Lead-Free Applications, Quantity 1648,5 ml = 3000 gram =3 kg		IMD-GL 230-3 kg
Energy supply (Single Phase + ground)	220-240 Volt / 50-60 Hz
Power drawn	2500 Watt (ca. 12 A)
Dimensions	840 x 640 x 460 mm (L x B x H)
max. solder product format	580 x 460 x 20 mm (L x B x H)
Standard cycle time	15 -20 Min
Soldering time	60 -90 Seconds
Process temperature (depends on medium type)	135 bis 240 °C
Weight	ca. 25 kg
Cooling	Forced air cooling
Heat transfer medium	GALDEN with the correct boiling temperature (max. 240 °C standard) 260 °C is possible as an option.
Medium basic filling quantity	ca. 1648.5 ml (1,65 Liter) 3 Kg GALDEN