IMD FLUX 8305 water-based no-clean flux for spray and foam applications

IMD FLUX 8305 is a completely water-based no-clean flux for spray and foam applications in component assembly of printed circuit boards. In practice, despite its water-based properties, IMD FLUX 8305 shows no disadvantages compared to alcohol-based fluxes in terms of preheating distance, soldering speeds, soldering bead formation and soldering quality. It is in no way comparable to the currently available water-based fluxes. The contamination residue measurement gives a value clearly below the required MIL specification of 1,300 µg / cm² equiv. NaCl over the entire period of 15 minutes.

IMD FLUX 8305 is based on organic acids, is completely free of volatile organic substances (VOC-free) and contains no halogens as well as synthetic / modified and natural resins. The existing oxide layers are easily removed with a low solids content of only 3.0% and protected against renewed oxidation during the preheating section. Due to the special chemical composition, the surface tension is reduced to such an extent that there is excellent wetting of the circuit board and extremely fast soldering speeds with Pb-free solders of up to 2.0 m / min. can be achieved! IMD FLUX 8305 can be used on conventional soldering systems and in a protective gas atmosphere for Pb-free and for Pb / Sn solders.

IMD FLUX 8305 can be used in automatic selective and wave soldering processes, with a wide process window for SMD / SMT and THT technology.

 

The flux IMD FLUX 8305 is very suitable for all common PCB end surfaces such as B .:

– Pb-free or Pb / Sn hot air leveling (HAL)

– Chemical nickel / gold (chemical Ni / Au)

– Chemical tin (chemical Sn)

– copper passivation (OSP)

IMD FLUX 8305 is a no-clean flux and leaves very little residue on the soldered circuit board. After the soldering process, washing or post-cleaning can generally be dispensed with, as possible residues have been shown not to be corrosive.

• Sprayable and foamable
• Excellent wetting properties, ensures high-gloss and even solder surfaces
• Via´s are very well filled with solder even at high speeds
• Reduces the surface tension, removes the oxide layers and protects the surface against renewed oxidation
• Halogen free; contains no chloride, bromide and fluoride
• 100% free of volatile organic components (VOC-free); contains no IPA, methanol, ethanol or other solvents
• Water-based, therefore not flammable
• No special and expensive thinners necessary, except for di-water
• No special storage regulations

(Ex-protected etc.), no dangerous goods

• Does not have a corrosive, low-solids effect after soldering
• Does not contain synthetic / modified or natural resins
• Does not leave any sticky residue after the soldering process
• 100% water-soluble, possible residues can be washed off with water after soldering
• No smell, biodegradable
• RoHS compliant, passed all tests according to IPC-TM-650 / J-STD-004. Classified as ORL0

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